Influence of carbon sputtering power on structure, corrosion resistance, adhesion strength and wear resistance of platinum/ruthenium/nitrogen doped diamond-like carbon thin films

Investigation of structure, adhesion strength, wear performance and corrosion behavior of platinum/ruthenium/nitrogen doped diamond-like carbon thin films with respect to film thickness

In this study, the corrosion performance of platinum/ruthenium/nitrogen doped diamond-like carbon (PtRuN-DLC) thin films deposited on p-Si substrates using a DCmagnetron sputtering deposition system in a 0.1M NaCl solution was investigated using potentiodynamic polarization test in terms of film thickness. Theeffect of thefilmthickness on the chemical composition, bonding structure, surfacemorp...

Nitrogen-Induced Degradation of Corrosion Resistance of Platinum/Ruthenium/Nitrogen-Doped Diamond-like Carbon Thin Films

An influence of nitrogen incorporation on the chemical composition, bonding structure, surface morphology and activity, adhesion strength, and corrosion resistance of platinum/ruthenium/nitrogen-doped diamond-like carbon PtRuN-DLC thin films deposited on conductive p-Si 100 substrates using dc magnetron sputtering deposition was investigated using X-ray photoelectron spectroscopy, micro-Raman s...

Enhancement of adhesion strength and corrosion resistance of nitrogen or platinum/ruthenium/nitrogen doped diamond-like carbon thin films by platinum/ruthenium underlayer

Investigation of corrosion behavior of nitrogen doped and platinum/ruthenium doped diamond-like carbon thin films in Hank's solution

Structure and corrosion behavior of platinum/ruthenium/nitrogen doped diamondlike carbon thin films

Platinum/ruthenium/nitrogen doped diamondlike carbon PtRuN-DLC thin films were deposited on p-Si 100 substrates with dc magnetron cosputtering by varying the dc power applied to a Pt50Ru50 target to investigate the effect of Pt and Ru incorporation in the films on the bonding structure, adhesion strength, surface morphology, and corrosion behavior of the films by means of X-ray photoelectron sp...